Solder paste is a mixture of solder powder and gelatinous flux.
When heated, the powder is fused in a flux environment, forming a brazed joint.
No Clean class flux gel paste, does not require cleaning.
Recommended for renovation work and small batch production.
Low-temperature solder paste is optimal for soldering LEDs, as well as for assembling double-sided PCBs when soldering the second side of the board (the first is soldered to a higher-temperature paste).
Characteristics:
The chemical composition of the solder alloy in percent:
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Sn (tin) - 42%
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Bi (bismuth) - 58%
Temperature range:
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preheat: 90-110°C
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reflow start: 138°C
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soldering temperature: 150°C
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storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for stencil application to the board.
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures from+5°C to+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.