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Whole catalog ↠ Materials for production and repair ↠ Heat transfer materials ↠ Heat-conducting substrates

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Product code:
032221

Thermal pad PM150 [1 mm, 100x100mm] for processor

Electrically insulating and heat-conducting silicone substrate, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 1 mm, sheet 100 x 100 mm.
Thermal pad PM150 [1 mm, 100x100mm] for processor
Manufacturer: Shenzhen Jrft Electronic Technology Co., Ltd. (JRFT)
In stock
82,83 UAH × = 82,83 UAH
from 1 pc : — 82,83 UAH
from 4 pcs : — 78,69 UAH ( -5,0%)
from 10 pcs : — 74,55 UAH ( -10,0%)

Current balances: 51 pcs


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Thermal pad PM150 [1 mm, 100x100mm] for processor

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It is used to ensure good heat transfer between the heat-generating component (processor, micro-assembly, LED) and the heatsink.
Also has dielectric properties, electrically isolating the heat sink from the component.
The silicone base gives the material high elasticity, the backing fills well the microrelief of the mating surfaces.
Aluminum nitride, which has excellent thermal conductivity, is used as a filler.
 
Characteristics:
  • thickness: 1mm
  • sheet size: 100 x 100 mm
  • thermal conductivity: 1.5W/mK
  • dielectric constant: 4.5 kV/mm
  • operating temperature range: -50°C+200°C
  • linear elongation ratio: 1.48



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