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Whole catalog Materials for production and repairHeat transfer materialsHeat-conducting substrates
Product code:
052728

Thermal pad PM460 [0.5 мм, 200х400мм] для процессора

Electrically insulating and thermally conductive silicone backing, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 0,5  mm, sheet 200 x 400 mm.
Thermal pad PM460 [0.5 мм, 200х400мм] для процессора
638,90 UAH × = 638,90 UAH
from 1 pc : 638,90 UAH
from 4 pcs : 606,80 UAH ( -5,0%)
from 10 pcs : 574,90 UAH ( -10,0%)

Current balances: 7 pcs


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Used to ensure good heat transfer between the heat-producing component (processor, microassembly, LED) and the heatsink.
Also has dielectric properties, electrically isolating the heatsink from the component.
The silicone base gives the material high elasticity, the substrate well fills the microrelief of the mating surfaces.
Aluminum nitride, which has excellent thermal conductivity, is used as a filler.

  • thickness: 0.5 mm
  • sheet size: 200 x 400 mm
  • thermal conductivity: 4.6 W/mK
  • dielectric constant: 6.5 kV/mm
  • operating temperature range: -50°C +200°C
  • linear elongation coefficient: 1.68
Characteristics:
JRF-PM460 Product Performance Parameter Table
Test Item (Unit) Value Test Standard
Model PM460 --
Thickness (mm) 0.25—5.0 ASTM D 347
Color Black Visual
Thickness Tolerance (mm) 0.05±0.01 ASTM D 347
Continuous Use Temperature (℃) -50~200 TGA+DMA
Thermal Conductivity (W/m-k) 4.6 ASTM D 5470
Volume Resistivity (Ω-cm) 1017 ASTM D 257
Breakdown Voltage 6.5KV ↑ ASTM D 149
Hardness (shore A) 50±5 ASTM D 2240
Specific Gravity 3.3 ASTM D 792
Tensile Strength (kg/cm²) 70 ASTM D 412
Elongation (%) 68 ASTM D 412
Environmental Protection (6) Check out IEC 62321
Halogen (4) Check out EN 14582
Flame Retardant Rating V----0 U.L 94

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